Huawei to develop own chip tech, reducing dependence on ASML

Chinese tech company Huawei said Monday it has developed a new method for manufacturing semiconductors that could allow it to produce cutting-edge chips within several years without relying on advanced lithography machines made by Dutch equipment maker ASML in Veldhoven.

At a conference on Monday, He Tingbo, head of Huawei’s chip division, said the company expects to be able to produce next-generation 1.4-nanometer chips by 2031. By comparison, Taiwan’s TSMC, the global market leader, has said it expects to begin mass production of chips at that same level in 2028.

Until now, industry experts have widely believed that EUV lithography machines are essential for producing increasingly small and powerful semiconductors. The machines, made by ASML, are roughly the size of a bus and cost hundreds of millions of dollars each, making them among the most expensive tools in the industry.

He Tingbo did not explain how Huawei intends to achieve advanced chip production without EUV systems. However, she emphasized that Huawei has designed and produced 381 chips over the past six years.

The announcement comes as EUV machines—extreme ultraviolet lithography systems—remain restricted from export to China under U.S. pressure, amid concerns that advanced semiconductor technology could be used for military purposes. Huawei has also faced years of sanctions tied to fears of digital espionage.